Intel 450 mm wafer production preparation in the year 2018 is fast.

Intel preparing investment of $ 6-8 billion to build new chip plant in the state of Oregon. The plant will be the first plant is prepared for the 450 mm wafer production.
However, Intel states that are not ready to switch to 450 mm wafer production immediately because the costs are very high. It is expected that production will begin very early in the year 2018.
Today, the largest wafer in the manufacturing process is an enhanced 300-mm wafer manufacturing will each have more chips. Proportion empty space left by wafer edge is less But the cost of the upgrade process is very high. By now, manufacturers provide upgrades to process 450 mm, including TSMC, Samsung, and Intel.
Source : Blognone, EE Times.